Shin-Etsu X23-7783D Thermal Compound 2 Gram

Shin-Etsu X23-7783D Thermal Compound 2 Gram

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Regular Price: $6.99

Special Price $3.99

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Quick Overview

This thermal interface compound is developed by Shin Etsu Chemical Co., Ltd. to meet the current and future requirements of high performance microprocessors. It is used to increase surface contact area for heat transfer by minimizing any air bubbles that exists between the top of the processor and the base of the heat sink.

Shin-Etsu X23-7783D Thermal Compound 2 Gram

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Details

This thermal interface compound is developed by Shin Etsu Chemical Co., Ltd. to meet the current and future requirements of high performance microprocessors. It is used to increase surface contact area for heat transfer by minimizing any air bubbles that exists between the top of the processor and the base of the heat sink.

The is a high performance thermal paste used on CPUs and GPUs. Perfect thermal paste to fix your XBOX 360's RROD (Red Ring Of Death) problem. It is also good for any general applications such as computers.

Don't be fooled by cheap thermal pastes sold on ebay, they don't give you any specification of the thermal paste, you don't know the Thermal Conductivity etc. If you have done enough research, you will realize that silver thermal paste has way better performance than the white ones, why? because it has silvers in it (that is why it has higher thermal conductivity), while white ones do not.

High performance thermal grease. Good for general applications. More forgiving in situations where the heatsink block is not a perfect finish.

Injector with cap for easy application and storage.

3gm syringe

Additional Information

Manufacturer TIAO Corp.
Warranty No
Thermal Conductivity 6.0 (W/m K)
Conductivity Non Conductive
Viscosity (Pa.s @ 25C) 200
Storage Conditions 60 F to 85 F (15 C - 29 C)

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